Highcon to use Packaging Innovations 2023 to Demonstrate Considerable Business Growth Opportunities unlocked by Digital Finishing
Yavne 24 January 2023 – Highcon Systems Ltd, the world’s pioneer in digital finishing systems for folding carton and corrugated packaging and display converters, will showcase its capabilities at Packaging Innovations 2023 on stand (N30) - 15-16 February, at the NEC, Birmingham. The company will use the show platform to highlight the benefits of its unique Highcon digital cutting and creasing systems, which enable printers and converters around the world to drive increased efficiencies, productivity, create new opportunities to diversify and grow and achieve their sustainability goals.
“We’re excited to bring digital finishing to the visitors of Packaging Innovations. This prestigious event gives us an opportunity to demonstrate our vision for the future of the industry, and our ability to support the needs of folding carton and corrugated converters today,” said Juergen Freier, General Manager and VP Sales at Highcon Europe.
“We will also show how the introduction of digital finishing can help meet the growing demand for boxes and highlight recent projects where our responsiveness to market requirements has helped to totally transform customer businesses, making packaging and display more agile, sustainable and engaging,” continued Freier.
Visitors to Highcon stand N30 will learn how Highcon Beam and Highcon Euclid digital finishing systems, take paperboard packaging to the next level - advancing sustainability measures, eliminating conventional dies, saving materials, allowing light-weighting corrugated board, replacing plastic and facilitating more easily recycled mono-material packaging.
The Highcon Beam 2 digital cutting and creasing system extends the digital finishing revolution to folding carton and commercial applications. With a speed of up to 5,000 B1 sheets per hour. Highcon technology replaces the expensive and slow conventional die-making and setup process with a digital technology that frees up analogue equipment for very long runs and delivers improved agility and the ability to perform a wide range of applications. The Beam 2C brings all the advantages of the flagship Beam 2 system to the corrugated market for packaging and display. The Beam 2C is available in two versions – a pallet feed standard configuration and a field upgradable non-stop feeding, stacking and waste removal configuration.
Visitors will also better understand Highcon’s vision for a fully implemented digital manufacturing vision, which extends beyond the finishing solution to take full advantage of digital capabilities for a streamlined workflow. The aim of which is to create real-time supply chains to synchronize supply and demand, and further drive business growth and profitability. This is where Highcon technology has proved itself to be a game-changer for converters and brands alike.
About Highcon
Highcon develops, markets, sells and supports a portfolio of digital cutting and creasing systems that cover a wide range of formats, substrates and applications. The Highcon technology is transforming the industry, by providing cost effective solutions to the increasing manufacturing inefficiencies facing folding carton and corrugated carton manufacturers as the result of the emerging market trends of e-commerce, shorter time to market, lower job sizes and a drive to sustainability. Such requirements cannot be accommodated by the expensive and slow conventional die-making and setup process. The Highcon digital technology bridges the gap between agile production and design flexibility delivering improved responsiveness, JIT production, short runs, customization of structure and design, and the ability to perform a wide range of applications in-house. Highcon products are installed at customer sites around the world, including some multi-national companies, effectively supporting the needs of global and local brands. Highcon is publicly traded in the Tel Aviv Stock Exchange (HICN) and its leading investors are Landa Ventures owned by Benny Landa and JVP led by Erel Margalit.